The Fan-Out Packaging (FOP) market is booming, projected to reach $2.94 billion by 2025 with a 16.5% CAGR. Driven by 5G, AI, and miniaturization trends, this report analyzes market segments (Core FOP, High-Density FOP, Ultra High-Density FOP), key players (TSMC, Samsung, ASE), and regional growth. Discover the future of advanced packaging.
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